T_IME_23_FY26I - Provision of One (1) Unit of Physical Vapor Deposition (PVD) Cluster tool(s) for Through Silicon Via (TSV) Barrier-Seed layers, Redistribution Layer (RDL) Barrier-Seed layers and Opti - Manufacturing & Industrial RFQ Singapore | Cotation
T_IME_23_FY26I - Provision of One (1) Unit of Physical Vapor Deposition (PVD) Cluster tool(s) for Through Silicon Via (TSV) Barrier-Seed layers, Redistribution Layer (RDL) Barrier-Seed layers and Opti
Provision of One (1) Unit of Physical Vapor Deposition (PVD) Cluster tool(s) for Through Silicon Via (TSV) Barrier-Seed layers, Redistribution Layer (RDL) Barrier-Seed layers and Optional Aluminum (Al) deposition on 200mm wafers.
